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MoU Signing Ceremony between D YPatil international University and Techovedas.
Calendar Monday, 10 August 2026

MoU Signing Ceremony between D YPatil international University and Techovedas.

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We are delighted to announce the signing of a Memorandum of Understanding (MoU) between D. Y. Patil International University (DYPIU) and Techovedas on 10th August 2026. Techovedas is a semiconductor-focused advisory and execution platform working towards enabling next-generation electronics and manufacturing ecosystems. This strategic collaboration aims to strengthen industry–academia engagement and create opportunities for knowledge exchange, industry exposure, skill development, innovation, and professional growth in the rapidly evolving semiconductor and electronics sector.
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