e are delighted to announce the signing of a Memorandum of Understanding (MoU) between D Y Patil International University (DYPIU), Pune, and United BC Sdn. Bhd., Malaysia, at the D Y Patil International University Booth at SEMICON India 2026, New Delhi. The MoU marks an important step towards strengthening international collaboration in the semiconductor ecosystem, with opportunities for academic and industry engagement, knowledge exchange, skill development, research collaboration, and fostering talent for the rapidly evolving semiconductor industry. The signing ceremony brought together representatives from both institutions at SEMICON India 2026, reflecting a shared commitment to developing globally relevant semiconductor capabilities and creating meaningful opportunities for students, faculty, and industry. This collaboration further reinforces DYPIU’s commitment to building strong industry–academia and international partnerships in the field of semiconductor engineering.